Establishment and primary application of a two-temperature polymerase chain reaction assay for detection of Haplosporidium sp. in shellfish--《Heilongjiang Animal Science and Veterinary Medicine》2013年13期
Establishment and primary application of a two-temperature polymerase chain reaction assay for detection of Haplosporidium sp. in shellfish
XIE Li-ji,XIE Zhi-xun,LIU Jia-bo,PANG Yao-shan,DENG Xian-wen,XIE Zhi-qin,FAN Qing(Guangxi Key Laboratory of Animal Vaccines and New Technology,Guangxi Veterinary Research Institute,Nanning 530001,China)
To establish the two-temperature PCR method for detection of Haplosporidium sp.,a pair of specific primers was designed according to the conserved gene sequence of Haplosporidium sp.published in GenBank,and then the amplification conditions of the two-temperature PCR method were optimized.The results showed that the specific DNA fragment of Haplosporidium sp.with the length of 333 bp was obtained using the PCR method for the amplification of Haplosporidium sp.as a template,which was consistent with the design of the test,but other pathogens such as Marteilia refringens,Perkinsus sp.,Vibrio parahaemolyticus,Vibrio aginolyticus,and Vibrio fluvialis were found to have negative results in the amplification by this two-temperature PCR.The results indicate that the two-temperature PCR method has thit can detect 1fg of plasmid DNA of Haplosporidium sp.
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Wafer process for molded chip scale package (mcsp) with thick backside metallization
Title: Wafer process for molded chip scale package (mcsp) with thick backside metallization.Abstract: A wafer process for MCSP comprises: depositing a metal bump on b forming a first packaging layer at front surface of wafer covering metal bumps while forming an un-covered ring at the edge of wafer to expose the ends of each scribe line located betwee thinning first packaging layer t grinding back surface of wafer to form a recessed space and a support ring at t depositing a metal seed layer and a thick metal layer at bottom surface of wafer in recessed cutting off the e and separating individual chips from wafer by cutting through first packaging layer, the wafer and the metal seed and metal layers along the scribe line. ...
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